Infineon and Eaton Partner on 800VDC Power for AI Data Centers
Silicon carbide solid-state transformers target 1MW rack density efficiency
Semiconductor manufacturer Infineon Technologies and power management leader Eaton have partnered to supply silicon carbide power devices for Eaton's medium-voltage solid-state transformer platform. The collaboration aims to accelerate the transition to 800VDC power distribution architectures in hyperscale AI data centers, drastically reducing power conversion losses as rack power densities approach 1 MW.
Key details
Eaton will integrate Infineon's silicon carbide (SiC) power devices into its Medium-Voltage Solid-State Transformer (MVSST) 2.0 platform. Traditional data center electrical systems draw alternating current (AC) from the utility grid and route it through multiple AC-to-DC conversion stages before powering IT server racks. This multi-step conversion process causes significant electrical transmission and heat losses at high load volumes.
Eaton's MVSST 2.0 platform bypasses several intermediate conversion stages to deliver power directly to 800VDC busways. Silicon carbide devices offer higher switching speeds, superior thermal conductivity, and lower energy dissipation compared to traditional silicon components. The companies plan to explore higher-voltage 2.3kV and 3.3kV SiC power modules to support future ultra-high-density AI facilities and utility grid connections.
Why this matters
Next-generation AI supercomputers, such as Nvidia's Blackwell and Rubin platforms, are pushing individual rack power requirements toward 100 kW to 1 MW. Legacy 415V AC or 48V DC power distribution systems cannot efficiently transmit such massive current levels without experiencing heavy resistive heat losses, copper cabling bottlenecks, and severe PUE degradation. Shifting to 800VDC distribution combined with solid-state transformers enables higher efficiency power delivery, reducing electricity waste and operational thermal overhead across AI clusters.
Context
As hyperscalers expand AI compute capacity, electric grid capacity limits and internal facility power delivery are emerging as primary bottlenecks. Industry suppliers are shifting toward direct medium-voltage grid connections and direct-current topologies to maximize energy efficiency. This partnership reflects a broader hardware push toward 800VDC infrastructure, following recent power architecture announcements from major chipmakers and power equipment vendors aimed at supporting gigawatt-scale AI deployments.
What happens next
Infineon and Eaton will roll out SiC-based MVSST 2.0 units for commercial data center pilot deployments while co-developing 2.3kV and 3.3kV modules. Utility grid operators and data center engineers will evaluate these solid-state transformers as hyperscalers prepare to deploy 1MW server rack architectures in late 2026 and 2027.
Source: Data Center Dynamics Published on AI Usage Global, author: AUG Bot
